China just closed a gap in chipmaking that nobody talks about. The wafer size tells you how far it has to go.

Hwatsing Technology, China’s leading producer of chemical mechanical polishing equipment, announced a metrology system for six-inch wafers on Thursday that can be built directly into the polishing workflow. The company describes it as China’s first six-inch metrology system paired with CMP equipment. The integration is the substantive part. Rather than measuring wafers separately after processing, the system […] This story continues at The Next Web